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Smart Watch

Smart Wireless Audio SoC

  • General Info
  • Technical Spec
  • Applications
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General Info

Actions Technology smart watch series products provide MCU+DSP dual-core Bluetooth® dual-mode single chip solution. With features such as low power consumption, high frame rate, and superior Bluetooth® performance. Additionally, support AI ENC call noise reduction technology. Integrated graphics acceleration engine and Senorhub module, Bluetooth® RF and baseband, power management unit (PMU), audio codec and micro control unit (MCU) modules. Make the smart watch smooth display and ultra long standby height match.

 

The chips of smart watches are mainly ATS3085L/3085C/3085,ATS3085E,ATS3085S,ATS3089

 

Technical Spec

CPU
DSP
GPU
MIC
Audio Effect
AI ENC
Bluetooth® Core
Max TX Power (BDR/BLE)
RX Sensitivity(Bluetooth®LE@1Mbps)
RX Sensitivity(Audio)
SensorHub
Internal RAM
SPI NOR
Standby Module
Interfaces
GPIO
Package
ATS3089C ATS3089 ATS3089P ATS3085S(4) ATS3085E ATS3085L
CPU MStar@202MHz MStar@202MHz MStar@202MHz MStar@202MHz MStar@192MHz ARM M4F@128MHz/ Cortex-M4F@128MHz
DSP DSP@202MHz DSP@202MHz DSP@202MHz DSP@202MHz DSP@192MHz DSP@192MHz
GPU 2D + 2.5D (JPEG Decoder) 2D + 2.5D (JPEG Decoder) 2D + 2.5D (JPEG Decoder) 2D + 2.5D (JPEG Decoder) 2D (JPEG Decoder) 2D
MIC 2AMIC OR 2DMIC 2AMIC OR 2DMIC 2AMIC OR 2DMIC 2AMIC OR 2DMIC 2AMIC OR 2DMIC 2AMIC OR 2DMIC
Audio Effect 20 Bands PEQ/DRC/AGC 20 Bands PEQ/DRC/AGC 20 Bands PEQ/DRC/AGC 20 Bands PEQ/DRC/AGC 20 Bands PEQ/DRC/AGC 20 Bands PEQ/DRC/AGC
AI ENC Single Single Single Single Single Single
Bluetooth® Core Dual-mode Bluetooth®6.0 Dual-mode Bluetooth®6.0 Dual-mode Bluetooth®6.0 Dual-mode Bluetooth®6.0 Dual-mode Bluetooth®6.0 Dual-mode Bluetooth®6.0
Max TX Power (BDR/BLE) 14dBm 14dBm 14dBm 14dBm 14dBm 13dBm
RX Sensitivity(Bluetooth®LE@1Mbps) -99dBm -99dBm -99dBm -99dBm -99dBm -98dBm
RX Sensitivity(Audio) -95dBm -95dBm -95dBm -95dBm -95dBm -95dBm
SensorHub
Internal RAM 1168KB + 8MB 1168KB + 16MB HPI PSRAM 1168KB + 32MB HPI PSRAM 1168KB + 4MB/8MB 1024KB 481KB SRAM + 4MB (OSPI DDR PSRAM)
SPI NOR 4MB(DTR) 8MB(DTR) 8MB(DTR) External(DTR) External(DTR) External(DTR)
Standby Module Shippingmode: <3uA + Deepsleep(no Ret):<20uA Shippingmode: <3uA + Deepsleep(no Ret):<20uA Shippingmode: <3uA + Deepsleep(no Ret):<20uA Shippingmode: <3uA + Deepsleep(no Ret):<20uA Shippingmode: <3uA + Deepsleep(no Ret):<20uA Shippingmode: <3uA + Deepsleep(no Ret):<20uA
Interfaces QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface QSPI/CPU8080/SPI/ Dual SPI Interface/
GPIO 60 60 60 49 49 46
Package TFBGA129 (5.5X5.5X0.4pitch) TFBGA129 (5.5X5.5X0.4pitch) TFBGA129 (5.5X5.5X0.4pitch) QFN68(7X7mm) QFN68(7X7mm) QFN68(7X7mm)

Applications

  • Smart Watch
  • Smart Bracelet
  • Bluetooth® Wearable Devices

Contact sales

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