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Wireless Transmitter

Smart Wireless Audio SoC

  • General Info
  • Technical Spec
  • Applications
  • Contact sales

General Info

Actions wireless transmission and transceiver series products series mainly consists of  Bluetooth® dual-mode(core 6.0) single-chip solutions, adopting a CPU+DSP+NPU tri-core heterogeneous architecture and equipped with Actions' third-generation private protocol technology. These products feature high audio quality, high bandwidth, high performance, low latency, and low power consumption, and can be widely applied to various Bluetooth transmitting and transceiving integrated products, such as wireless microphones, gaming headsets and their dongles, conference speaker dongles, telephone headset dongles, TV dongles, game console dongles, walkie-talkie adapters, Bluetooth transmitting slave modules, transceiving integrated slave modules, projectors/CD/DVDs, and other related products that need to support Bluetooth transmission (connecting to Bluetooth headsets or speakers) and low-latency wireless audio transceiving.

 

Actions Technology is good at providing high-quality audio and low-latency wireless audio experiences under the premise of low power consumption. The main products in this series are equipped with advanced high-quality audio technology and low-latency technology. The ATS3231 series integrates a breakthrough NPU + DSP fusion architecture, excellent audio performance, strong wireless performance, and low-latency wireless transmission. It can be equipped with Actions' self-developed 48K AI NPU noise reduction algorithm to achieve full-scene adaptive and high-fidelity microphone AI noise reduction. With Actions' 2.4G private protocol, it can achieve an ultra-low end-to-end latency of 9ms, providing high-quality audio experience and high-definition call experience while meeting the requirements of low-latency transmission.

 

The currently promoted Bluetooth® transmitting and transceiving integrated chips include: ATS3231, ATS3031, and ATS2831 .

 

 

Technical Spec

CPU
DSP
AI NPU
ADC SNR
ADC THD+N
DAC SNR
Bluetooth® Core
Bluetooth® LE Audio
NGPP-2.4 Low latency(end to end)
Connection Mode
Wireless bandwidth(MAX)
Max TX Power (BR)
LCD
RAM
SPI norflash
Interfaces
GPIO
Package
ATS3231CL/AL ATS3031(L) ATS2831P(L) ATS2851
CPU ARM STAR MC1@264MHz ARM M4F@96MHz 32bits RISC@264MHz 32bits RISC@234MHz
DSP Cadence HiFi5+NN@504MHz CEVA TL420@170MHz 32bits DSP@342MHz
AI NPU 100GOPS@INT8 CIM based
ADC SNR 2-Channel/4-Channel SNR>112dB 2-Channel SNR>104dB 2-Channel SNR>96dB 2-Channel SNR>98dB
ADC THD+N -100dB(THD+N) -91dB(THD+N) -85dB(THD+N) -89dB(THD+N)
DAC SNR 120dB 114dB 101dB 100dB
Bluetooth® Core 6.0 6.0 5.4 5.4
Bluetooth® LE Audio
NGPP-2.4 Low latency(end to end) 9ms (2.5ms LC3+HR) 23ms(NAV) 23ms(2831P NAV)/ 10ms(2831PL LC3+)
Connection Mode 2T1R, 4T1R, 2T4R 2T1R 2T1R, 1T2R 1T2R
Wireless bandwidth(MAX) 4Mbps(Dual RF) 2Mbps(Single RF) 2Mbps(Single RF) 2Mbps(Single RF)
Max TX Power (BR) 16dBm 13dBm 10dBm 10dBm
LCD SPI LCD Built in display accelerator, up to 466*466 60fps SPI LCD SPI LCD SPI LCD
RAM 2.88MB 632KB 498KB 203KB
SPI norflash 64Mbits Flash 16Mbits Flash 32Mbits Flash 16Mbits Flash
Interfaces USB2.0 HS DRD,UART*3,ADC*4,DAC*2,I2S*2,SDIO/ EMMC USB2.0 FS,UART*2, Linein/I2S/MIC USB2.0 HS,UART*2, Linein/SPDIF/I2S/MIC,SDIO/ USB2.0 FS,UART*2, Linein/I2S/MIC/EMMC
GPIO 42/53 16 14 11
Package QFN68 (7X7mm)/QFN80 (8X8mm) QFN44 (4X5mm) QFN40 (5X5mm) QFN32 (4X4mm)

Applications

  • Bluetooth® Transmitter
  • Bluetooth® transceiver integrated device
  • Wireless Gaming Headsets
  • Wireless microphone
  • Desktop Microphone
  • Wireless Livestream Sound Card

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